Formnext Asia Shenzhen , the additive manufacturing trade show organized by Guangzhou Guangya Messe Frankfurt Co Ltd , will return to the Shenzhen World Exhibition & Convention Center from August 26 to 28, 2026, with a focus on how 3D printing is being used to produce liquid cooling components for AI infrastructure. As higher-density AI server chips generate more heat than traditional air cooling can handle efficiently, the exhibition will highlight the machines, materials, software, post-processing technologies, and production services used to manufacture these parts. Liquid cooling is becoming more important as AI computing loads increase. In these systems, coolant passes through metal cold plates mounted directly on chips, removing heat before it builds up. Producing those parts becomes difficult when internal channels need to curve, branch, or closely follow chip layouts.…