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TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package
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TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package

Latest from Tom's Hardware ·Anton Shilov·about 10 hours ago
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TSMC is exploring panel-level packaging and is working on its CoPoS technology, but the company's Kevin Zhang says wafer-level packaging technologies is considerably more advanced than panel-level packaging.

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