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Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of EMIB-T later this year
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Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of EMIB-T later this year

Latest from Tom's Hardware ·Luke James·about 2 months ago
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#tomshardware#intel#understood#active#talks#google
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Intel is understood to be in active talks with Google and Amazon to provide advanced chip packaging services for their custom AI ASICs.

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