Ravi Mahajan discusses the idea for a simple silicon bridge and why it is becoming a foundational technology for the AI era. Ravi Mahajan is a foundational figure behind Intel’s leadership in advanced packaging. As an Intel Fellow and director of Substrate and Advanced Packaging Pathfinding at Intel Foundry , he has spent more than 30 years advancing semiconductor packaging technologies. Often referred to as the inventor of EMIB (Embedded Multi-die Interconnect Bridge), Mahajan led the development of this groundbreaking technology that enables multiple chips to be tightly interconnected within a single package, an increasingly important capability as AI workloads drive demand for higher performance, bandwidth and energy efficiency. In this conversation, he reflects on his career, the origins of EMIB, the growing importance of advanced packaging, and why system-level innovation is becoming central to the future of computing.…