An in-depth examination of how rising power density, 3D integration, and novel materials are outpacing legacy thermal measurement — and what advanced metrology must deliver. **What Attendees will Learn** Why heat is now the dominant constraint on semiconductor scaling — Explore how heterogeneous integration, 3D stacking, and AI-driven power density have shifted the primary bottleneck from lithography to thermal management, with heat flux projections exceeding 1,000 W/cm² for next-generation accelerators. - How extreme material properties are redefining thermal design requirements —Understand the measurement challenges posed by nanoscale thin films where bulk assumptions fail, engineered ultra-high-conductivity materials (diamond, BAs, BNNTs), and devices operating above 200 °C in wide-band gap systems. - Why interfaces and buried layers now govern reliability — Examine how thermal boundary resistance at bonded interfaces, TIM layers, and dielectric stacks has become a first-order reliability accelerator.…