Broadcom has added FuriosaAI to its list of partners building AI accelerators atop its chip packaging tech. After years quietly serving as the connective tissue behind many modern processors, Broadcom has emerged from the shadows to bask in the glow of the AI bubble. The silicon slinger's latest tie-up aims to adapt FuriosaAI's Tensor Contraction Processor tech into a multi-die system-on-package designed for the high-volume AI inference workloads that are all the rage these days. Details on the new chip remain thin, but FuriosaAI claims that the processor will be fabbed on a 2nm process and make use of "dual layer" HBM4 or HBM4e memory made possible by Broadcom's advanced packaging tech. We've previously explored Broadcom's Extreme Dimension System in Package (3.5D XDSiP) tech, which aims to simplify the process of bringing complex multi-die accelerators similar to AMD's MI300 series to market.…