Intel demonstrated a UCIe-S die-to-die interconnect on 22nm hitting 48 Gb/s/lane over standard organic substrate, beating a 3nm EMIB design with 3× higher data rate and 2.8× higher bandwidth density. This signals a strategic shift away from EMIB for Intel's own products toward UCIe over substrate. Key Takeaways Intel demonstrated a UCIe-S die-to-die interconnect on 22nm hitting 48 Gb/s/lane over standard organic substrate, beating a 3nm EMIB design with 3× higher data rate and 2.8× higher bandwidth density. This signals a strategic shift away from EMIB for Intel's own products toward UCIe over substrate. Intel's UCIe-S Hits 48 Gb/s on 22nm, Beats 3nm EMIB Intel is shifting its internal packaging strategy away from EMIB (Embedded Multi-die Interconnect Bridge) toward UCIe (Universal Chiplet Interconnect Express) over standard organic substrate — a move that could reshape its competitive position in advanced packaging.…